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MOQ: | 1 pieces |
Price: | Contact us |
Standard Packaging: | Based on customer needs |
Delivery Period: | 2-7 working days |
Express | |
R7525 | |
Payment Method: | L/C,D/A,D/P,T/T,Western Union |
Supply Capacity: | /pieces >=2 pieces |
Technology | Detailed Description |
---|---|
AMD® EPYC™ Generation 2 and Generation 3 processors |
|
3200 MT/s DDR4 memory |
|
PCIe Gen and slot | Gen 4 at 16 T/s |
Flex I/O |
|
CPLD 1-wire | Support payload data of front PERC, Riser, backplane and rear I/O to BIOS and IDRAC |
Dedicated PERC | Front storage module PERC with front PERC 10.4 |
Software RAID | Operating system RAID/PERC S 150 |
iDRAC9 with Lifecycle Controller | Embedded systems management solution featuring hardware/firmware inventory, alerting, dedicated Gb port, and enhanced performance |
Wireless Management | Quick Sync 2.0 offers wireless at-the-box system management with improved user experience |
Power supply |
|
Boot Optimized Storage Subsystem S2 (BOSS S2) |
|
Liquid cooling solution |
|
Feature | PowerEdge R7525 | PowerEdge R7425 |
---|---|---|
Processor | Two AMD® EPYC™ Generation 2 or Generation 3 processors | Two AMD Naples™ socket SP3 compatible processors |
CPU Interconnect | Inter-chip global memory interconnect (xGMI-2) | AMD Socket to Socket Global Memory Interface (xGMI) |
Memory | 32x DDR4 RDIMM, LRDIMM, 3DS | 32x DDR4 RDIMM, LRDIMM |
Disk Drives | 3.5-inch, 2.5-inch: 12G SAS, 6G SATA, NVMe HDD | 3.5-inch, 2.5-inch: 12G SAS, 6G SATA HDD |
Storage Controllers | H755, H755N, H745, HBA345, HBA355, H345, H840, 12G SAS HBA, SW RAID: S150 | Adapters: H330, H730P, H740P, H840, HBA330, 12G SAS HBA, SW RAID: S140 |
PCIe SSD | Up to 24x PCIe SSD | Up to 24x PCIe SSD |
PCIe Slots | Up to 8 (PCIe 4.0) | Up to 8(Gen3 x16) |
rNDC | 2 x 1 GB | Select Network Adapter NDC: 4 x 1 GB, 4 x 10 GB, 2 x 10 GB + 2 x 1 GB, or 2 x 25 GB |
OCP | Yes for OCP 3.0 | NA |
USB Ports | Front: 1 x USB 2.0, 1 x iDRAC USB (Micro-AB USB) Rear: 1 x USB 3.0, 1 x USB 2.0 Internal: 1 x USB 3.0 | Front: 1 x USB2.0, 1 x iDRAC USB(Micro USB), Optional 1xUSB 3.0 front port Rear: 2 x USB3.0 Internal: 1 xUSB3.0 |
Rack Height | 2U | 2U |
Power Supplies | Mixed Mode (MM) AC/HVDC (Platinum) 800 W, 1400 W, 2400 W | AC Platinum: 2400 W, 2000 W, 1600 W, 1100 W, 495 W 750 W AC Platinum: Mixed Mode HVDC (for China only), Mixed Mode AC, DC (DC for China only) 1100 W -48 V DC Gold |
System Management | LC 3.x, OpenManage, QuickSync2.0, OMPC3, Digital License Key, iDRAC Direct (dedicated micro-USB port), Easy Restore | LC 3.x, OpenManage, QuickSync 2.0, Digital License Key, iDRAC9, iDRAC Direct (dedicated micro-USB port), Easy Restore, vFlash |
GPU | 3 x 300 W (DW) or 6 x 75 W (SW) | 3 x 300 W (DW) or 6 x 150 W (SW) |
Availability | Hot-plug drives, Hot-plug redundant power supplies, BOSS, IDSDM | Hot-plug drives, Hot-plug redundant power supplies, BOSS, IDSDM |
![]() |
MOQ: | 1 pieces |
Price: | Contact us |
Standard Packaging: | Based on customer needs |
Delivery Period: | 2-7 working days |
Express | |
R7525 | |
Payment Method: | L/C,D/A,D/P,T/T,Western Union |
Supply Capacity: | /pieces >=2 pieces |
Technology | Detailed Description |
---|---|
AMD® EPYC™ Generation 2 and Generation 3 processors |
|
3200 MT/s DDR4 memory |
|
PCIe Gen and slot | Gen 4 at 16 T/s |
Flex I/O |
|
CPLD 1-wire | Support payload data of front PERC, Riser, backplane and rear I/O to BIOS and IDRAC |
Dedicated PERC | Front storage module PERC with front PERC 10.4 |
Software RAID | Operating system RAID/PERC S 150 |
iDRAC9 with Lifecycle Controller | Embedded systems management solution featuring hardware/firmware inventory, alerting, dedicated Gb port, and enhanced performance |
Wireless Management | Quick Sync 2.0 offers wireless at-the-box system management with improved user experience |
Power supply |
|
Boot Optimized Storage Subsystem S2 (BOSS S2) |
|
Liquid cooling solution |
|
Feature | PowerEdge R7525 | PowerEdge R7425 |
---|---|---|
Processor | Two AMD® EPYC™ Generation 2 or Generation 3 processors | Two AMD Naples™ socket SP3 compatible processors |
CPU Interconnect | Inter-chip global memory interconnect (xGMI-2) | AMD Socket to Socket Global Memory Interface (xGMI) |
Memory | 32x DDR4 RDIMM, LRDIMM, 3DS | 32x DDR4 RDIMM, LRDIMM |
Disk Drives | 3.5-inch, 2.5-inch: 12G SAS, 6G SATA, NVMe HDD | 3.5-inch, 2.5-inch: 12G SAS, 6G SATA HDD |
Storage Controllers | H755, H755N, H745, HBA345, HBA355, H345, H840, 12G SAS HBA, SW RAID: S150 | Adapters: H330, H730P, H740P, H840, HBA330, 12G SAS HBA, SW RAID: S140 |
PCIe SSD | Up to 24x PCIe SSD | Up to 24x PCIe SSD |
PCIe Slots | Up to 8 (PCIe 4.0) | Up to 8(Gen3 x16) |
rNDC | 2 x 1 GB | Select Network Adapter NDC: 4 x 1 GB, 4 x 10 GB, 2 x 10 GB + 2 x 1 GB, or 2 x 25 GB |
OCP | Yes for OCP 3.0 | NA |
USB Ports | Front: 1 x USB 2.0, 1 x iDRAC USB (Micro-AB USB) Rear: 1 x USB 3.0, 1 x USB 2.0 Internal: 1 x USB 3.0 | Front: 1 x USB2.0, 1 x iDRAC USB(Micro USB), Optional 1xUSB 3.0 front port Rear: 2 x USB3.0 Internal: 1 xUSB3.0 |
Rack Height | 2U | 2U |
Power Supplies | Mixed Mode (MM) AC/HVDC (Platinum) 800 W, 1400 W, 2400 W | AC Platinum: 2400 W, 2000 W, 1600 W, 1100 W, 495 W 750 W AC Platinum: Mixed Mode HVDC (for China only), Mixed Mode AC, DC (DC for China only) 1100 W -48 V DC Gold |
System Management | LC 3.x, OpenManage, QuickSync2.0, OMPC3, Digital License Key, iDRAC Direct (dedicated micro-USB port), Easy Restore | LC 3.x, OpenManage, QuickSync 2.0, Digital License Key, iDRAC9, iDRAC Direct (dedicated micro-USB port), Easy Restore, vFlash |
GPU | 3 x 300 W (DW) or 6 x 75 W (SW) | 3 x 300 W (DW) or 6 x 150 W (SW) |
Availability | Hot-plug drives, Hot-plug redundant power supplies, BOSS, IDSDM | Hot-plug drives, Hot-plug redundant power supplies, BOSS, IDSDM |